As discussed by Randall and co-work

As discussed by Randall and co-workers [13], cold sintered (120 C) ceramics may be integrated with polymers and offer the potential through screen printing of the fabrication of layers ofceramic directly onto circuit boards, thereby enhancing εr, m and Qf of the MW substrate. Recently, Wang et al. [14] reported temperature stable cold sintered composite with Qf ~ 7000 and εr ~17. The direct integration of xBF12-(1-x)LMO and related cold sintered materials onto PCBs may offer technological solutions in devices where the dielectric loss of the substrate is paramount or potentially when a dual mode RF response is required based on m and εr.