Ceramic-polymer composites hold the

Ceramic-polymer composites hold the key to the development of various multifunctional devices due to their enhanced material properties. The polymers, despite having high dielectric strength, exhibit low dielectric permittivity. On the other hand, ceramics suffer from low dielectric strength,difficult processing steps, and poor ductility, but they show an order of magnitude higher dielectric permittivity than that of polymers. In order to overcome the limitations of both polymers and ceramics, researchers made great efforts in the past decade to enhance the dielectric permittivity of polymers by introducing ceramic fillers to the polymer matrix. Usually, making a composite with the polymer is a difficult task because of the vast difference in the firing temperature of both the ceramics and polymers. Over the years, various nanocomposites were studied with ceramic nanoparticles dispersed in a polymer matrix within the percolation limit. Beyond this limit, randomly dispersed ceramic particles start to accumulate and form interconnected pathways across the composites.Problems with the percolation limit can be partially rectified by using ceramics as a matrix in the composites. However, considering the large difference in the fabrication temperature of polymers and ceramics (1000℃),preparation of such composites becomes very difficult. However, with the advent of the cold sintering process (CSP), these composites can be formed where the co-firing of ceramics and polymer takes place. This also provides an opportunity to make dense samples, which is rather difficult in the case of the polymer matrix.